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Electrical bonding of the panel frame to the substructure

To offer a rapid and simple solution for electrical bonding of the substructure to the panel frame, we have fitted our panel clamps with an extra component: “stainless steel electrical bonding plate” on the underside of the clamp plate.

The electrical bonding ensures that there is always an electrically conductive contact created when the clamp is tightened correctly onto the panel frame. At that moment the anodisation layer of the panel frame is breached by the small points found on the plate.


The revised version of the panel clamps is suitable for application in new and existing ValkPro+ and ValkPitched mounting systems.